ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,919, issued on Aug. 18, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Semiconductor package structure" was ... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,920, issued on Aug. 18, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Power semiconductor module arrangement compri... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,921, issued on Aug. 18, was assigned to Volantis Semiconductor Inc. (Portland, Ore.). "Cold plate cooling for wafer-scale integration with ... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,922, issued on Aug. 18, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan) and Universal Scientific Industrial (Sha... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,923, issued on Aug. 18, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device module and method for manufacturing same" ... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,924, issued on Aug. 18, was assigned to Intel Corp. (Santa Clara, Calif.). "Device, method, and system to protect through-dielectric vias o... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,925, issued on Aug. 18, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor device and method of manufactur... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,926, issued on Aug. 18, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Method for processing a semiconductor wafer and sem... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,927, issued on Aug. 18, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Reinforcement structure and electronic device" was... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,928, issued on Aug. 18, was assigned to Intel Corp. (Santa Clara, Calif.). "EMI cage for microstrip routing via dual layer underfill concep... Read More